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Material FR-4
Board thickness 62mil
Min. Line Width/Spacing 4/4mil
Min. Finish Hole's Size 10mil
Number of Layers 4Layer
Soldermask Color Blue
Surface Finishing Immersion Gold
Blind/Buried Vias
Controlled Impedance
Vias on Pad
 
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Material FR-4 TG170
Board thickness 62mil
Min. Line Width/Spacing 5/5mil
Min. Finish Hole's Size 8mil
Number of Layers 10Layer
Soldermask Color Green
Surface Finishing Immersion Ag
Blind/Buried Vias
Controlled Impedance
Vias on Pad
 
 
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Material FR-4
Board thickness 62mil
Min. Line Width/Spacing 8/4mil
Min. Finish Hole's Size 16mil
Number of Layers 2Layer
Soldermask Color Green
Surface Finishing Immersion Tin;Carbon ink on keypad
Blind/Buried Vias
Controlled Impedance
Vias on Pad
     
 
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