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Material FR-4
Board thickness 39mil
Min. Line Width/Spacing 5/5mil
Min. Finish Hole's Size 8mil
Number of Layers 4Layer
Soldermask Color Green
Surface Finishing Immersion Gold
Blind/Buried Vias
Controlled Impedance
Vias on Pad YES
 
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Material FR-4
Board thickness 62mil
Min. Line Width/Spacing 4/4mil
Min. Finish Hole's Size 12mil
Number of Layers 8Layer
Soldermask Color Green
Surface Finishing Immersion Gold with Gold Finger
Blind/Buried Vias
Controlled Impedance 32、37、40、50、90、95 Ω
Vias on Pad
 
 
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Material FR-4 TG170
Board thickness 70mil
Min. Line Width/Spacing 5/5mil
Min. Finish Hole's Size 8mil
Number of Layers 12Layer
Soldermask Color Green
Surface Finishing HASL
Blind/Buried Vias
Controlled Impedance 50Ω、100Ω、120Ω
Vias on Pad
 
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Material FR-4
Board thickness 87mil
Min. Line Width/Spacing 6/10mil
Min. Finish Hole's Size 12mil
Number of Layers 14Layer
Soldermask Color Green
Surface Finishing Immersion Gold
Blind/Buried Vias
Controlled Impedance 50Ω、100Ω
Vias on Pad
 
 
 
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Material FR-4
Board thickness 62mil
Min. Line Width/Spacing 6/6mil
Min. Finish Hole's Size 10mil
Number of Layers 6Layer
Soldermask Color Green
Surface Finishing HASL
Blind/Buried Vias Blind Vias
Controlled Impedance
Vias on Pad
 
more information >>
Material FR-4
Board thickness 62mil
Min. Line Width/Spacing 5/5mil
Min. Finish Hole's Size 12mil
Number of Layers 10Layer
Soldermask Color Green
Surface Finishing Immersion Gold
Blind/Buried Vias
Controlled Impedance
Vias on Pad
 
 
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