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	more information >> Material FR-4 Board thickness 39mil Min. Line Width/Spacing 5／5mil Min. Finish Hole's Size 8mil Number of Layers 4Layer Soldermask Color Green Surface Finishing Immersion Gold Blind／Buried Vias － Controlled Impedance － Vias on Pad YES   more information >> Material FR-4 Board thickness 62mil Min. Line Width/Spacing 4／4mil Min. Finish Hole's Size 12mil Number of Layers 8Layer Soldermask Color Green Surface Finishing Immersion Gold with Gold Finger Blind／Buried Vias － Controlled Impedance 32、37、40、50、90、95 Ω Vias on Pad －     more information >> Material FR-4 TG170 Board thickness 70mil Min. Line Width/Spacing 5／5mil Min. Finish Hole's Size 8mil Number of Layers 12Layer Soldermask Color Green Surface Finishing HASL Blind／Buried Vias － Controlled Impedance 50Ω、100Ω、120Ω Vias on Pad －   more information >> Material FR-4 Board thickness 87mil Min. Line Width/Spacing 6／10mil Min. Finish Hole's Size 12mil Number of Layers 14Layer Soldermask Color Green Surface Finishing Immersion Gold Blind／Buried Vias － Controlled Impedance 50Ω、100Ω Vias on Pad －       more information >> Material FR-4 Board thickness 62mil Min. Line Width/Spacing 6／6mil Min. Finish Hole's Size 10mil Number of Layers 6Layer Soldermask Color Green Surface Finishing HASL Blind／Buried Vias Blind Vias Controlled Impedance － Vias on Pad －   more information >> Material FR-4 Board thickness 62mil Min. Line Width/Spacing 5／5mil Min. Finish Hole's Size 12mil Number of Layers 10Layer Soldermask Color Green Surface Finishing Immersion Gold Blind／Buried Vias － Controlled Impedance － Vias on Pad －           Top
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