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2000.11. |
MIL technology
Co.,Ltd. was established in 1981. |
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2000. |
Planned new factory by
shareholders |
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2001. |
Added D/F¡BTest equipments |
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2002.05. |
Expended process capacity
to Layers 4.6.8 |
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2004.02. |
Expended process capactity
to layers 12 |
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2006.06. |
Expended to layers 20
¡ABoard thickness 0.008¡¨~0.137¡¨, Line width/space 4/4mil with
RoHs compliant |
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2007. |
Via in Pad |
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Our Mission |
It is our clear
intention to expand our global presence and market leadership.
As we expand our worldwide presence, we will continue to extend
our capabilities in the development, marketing and sale of our
leading edge applications. |
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MIL Technology Co., Ltd was established in 2000.Since conception we have been in the field of Printed Circuit Boards.We keep improving our products and the technology used. Our staff is highly skilled and we adopt strict quality control standards.
Our products are used extensively in many industries including:
* Computer products
* Consumer goods
* Medical equipment
* Electric machinery
* Automobile components
* Telecommunications
We are committed to provide outstanding product quality at a competitive price and accurate delivery. |
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Max. board size |
21¡¨*24¡¨ |
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Board thickness |
0.015¡¨~0.138¡¨ |
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Layers |
1~20Layers |
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Copper cladding |
0.5~3oz |
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Aspect ratio |
7:1 |
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Impedance control |
50ohm+/-10% |
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Thickness tolerance |
+/-0.005¡¨ |
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Min. hole size |
0.008¡¨ |
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True position |
+/-0.003¡¨ |
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Min. Line width/space for Outer and Inner |
3/3mil¡B4/4mil |
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Tending |
0.010¡¨~0.0256¡¨ |
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The plating thickness of G/F |
2~30u¡¨ |
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The plating thickness of Electronless gold |
2~5u¡¨ |
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Silkscreen width |
0.030¡¨ |
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CNC- Router / Punch |
+/-0.005¡¨ / +/-0.003¡¨ |
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E-Test condition |
200V 5M 50ohm |
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CAM system |
Genesis 2000 |
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Surface treatment |
OSP, HASL, Immersion Gold/Tin/Ag, Carbon Print, Peelable Mask, Lead-Free HASL |
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Base material |
FR-4, CEM-3, Hi-TG 150/170 |
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